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Product information "Heat conduction contact pad 20 x 20 x 3 mm"
This thermally conductive pressure pad can be used universally (easily cut to size) and adapts very flexibly to gaps. It is available in various sizes and thicknesses and is electrically non-conductive.
It is used, for example, in the cooling of chipsets, voltage converters and memory devices.
This website uses cookies, which are necessary for the technical operation of the website and are always set. Other cookies, which increase the usability of this website, serve for direct advertising or simplify interaction with other websites and social networks, will only be used with your consent. More information
