This thermally conductive pressure pad can be used universally (easily cut to size) and adapts very flexibly to gaps. It is available in various sizes and thicknesses and is electrically non-conductive.
It is used, for example, in the cooling of chipsets, voltage converters and memory devices.
|Type:||Foil / pad|
|Dimensions:||20 x 20 x 3 mm (LxBxH)|