The special pad for chipset cooling is optimally suited for cooling chipsets that have an exposed core without a support frame (spacer or heatspreader).
Such exposed chips usually consist of a ceramic substrate, which is very sensitive and can therefore be easily damaged. In addition, there are often open components on the board, which can easily lead to a short circuit if the cooler is not mounted correctly.
These problems can be easily and reliably avoided with the special pad, which acts like a stabilizer between the cooler and the chip and fills the resulting gap. This eliminates the possibility of the cooler jamming and thus endangering the core. Furthermore, the components on the chip are covered, which also reliably prevents possible short circuits.
|Type:||Foil / pad|