Thermally conductive adhesive for your cooling system
The power loss that occurs in both small and large systems is dissipated with a cooling system, with heat sinks being mounted on the heat source for this purpose. A thermally conductive layer is placed between the cooler and the heat source in order to optimize the transfer of waste heat.
Often, however, such coolers cannot be fixed to the heat source with screws, clamps or similar aids, which leads many users to major problems when planning and implementing the absolutely necessary cooling.
But the solution is very simple: The use of a high-quality thermally conductive adhesive allows secure mounting on the heat source without additional mechanical fixation - regardless of the position, size or type of the cooling component. An optimally suitable heat transfer agent for this is the innovatek High Silver thermal adhesive, which ensures the dissipation of the power loss and also enables very easy application.
innovatek High Silver thermal adhesive
The two-component thermal adhesive is based on epoxy and a high proportion of silver oxide, which is where the excellent performance of the thermal adhesive comes from. In addition to its performance, the adhesive can also be used at different temperatures and fills larger gaps if necessary.
In addition, the thermally conductive adhesive we offer offers different pot lives (processing time until the applied adhesive has hardened) in order to guarantee the optimal solution for the respective application.